Magnetron sputtering thesis
From: Salvs R.
Category: cope stress
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The goal of this thesis was to provide scientific and technical research results for developing and characterizing tantalum Ta coatings on steel substrates deposited by DC magnetron sputtering. Deposition of tantalum on steel is of special interest for the protection it offers to surfaces, e. Electro-plated chromium is presently most commonly used for this purpose; however, it is considered to be carcinogenic in its hexavalent form. Tantalum is being investigated as non-toxic alternative to chromium and also because of its superior protective properties in these extreme environments. DC magnetron sputtering was chosen for this investigation of tantalum coatings on steel substrates because it is a versatile industrial proven process for deposition of metals. Sputter deposited Ta films can have two crystallographic structures: 1 body center cubic bcc phase, characterized by high toughness and high ductility and 2 a tetragonal beta phase characterized by brittleness and a tendency to fail under stress.
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RF Magnetron Sputtering of Transparent Conducting Oxides and CdTe/CdS Solar Cells - Durham e-Theses
Batteries and supercapacitors are promising candidates for electrochemical energy storage while the development of their electrode materials is becoming a bottleneck. Herein, we present the research progress of magnetron sputtering enabled nanostructured materials as electrode materials for electrochemical energy storage. Firstly, magnetron sputtered anode materials Si-based materials, metal-based materials, metal oxides, etc. Secondly, magnetron sputtered electrode materials metals and metal oxides, metal nitrides, etc. Furthermore, critical insights into the corresponding electrical conductivity and cycling stability of the electrode materials are provided through illustrations of how to rationally design and optimize electrode materials via magnetron sputtering technology. Finally, the emerging challenges and future directions of magnetron sputtered electrode materials for electrochemical energy storage are discussed. If you are not the author of this article and you wish to reproduce material from it in a third party non-RSC publication you must formally request permission using Copyright Clearance Center.
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An Overview of Magnetron Sputtering
Sputter deposition is a physical vapor deposition PVD method of thin film deposition by sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. The sputtered ions typically only a small fraction of the ejected particles are ionized — on the order of 1 percent can ballistically fly from the target in straight lines and impact energetically on the substrates or vacuum chamber causing resputtering. Alternatively, at higher gas pressures, the ions collide with the gas atoms that act as a moderator and move diffusively, reaching the substrates or vacuum chamber wall and condensing after undergoing a random walk.